2. Manufacturability: This test ensures that the carrier tape can be used in the manufacturingequipment without any problems, and that the tape is of sufficient quality to allow forproblem-free shipping to our customers.
3. Surface resistivity test: This test ensures that the carrier tape falls within the EIA-625guidelines for static dissipative materials. The static dissipative range has a surfaceresistivity between 104 and 1011 ?/square. This range is chosen for TI material to helpcontrol tribocharging and ESD discharges, if present.
4. Camber: This test ensures that the carrier tape is straight and not bowed. The tape musthave less than 1 mm of camber per 250-mm length to meet qualification requirements.
Fit analysis: This test ensures that the package fits within the cavity according toindustry-standard guidelines. For traditional packages, such as SOIC, if the pocket is toolarge, there can be excessive rotation that can cause many machine stops during pick andplace. Additionally, an excessively large cavity can cause more bent leads. BecauseSurftape uses an adhesive tape to hold the package, rotational and bent-lead concernsare not an issue. This test is not performed, other than to ensure that the package fits inthe tape cavity.
6. Drop test: TI final packaged reels are dropped six times on a concrete surface from aheight of 30 inches to ensure that no damage occurs if the box is dropped during shippingor handling. The drop height is normal tabletop height and hand-carrying height. No unitswere dislodged when dropped.
7. Shelf Life: TI product has a two-year shelf life. Product must remain usable for this period.
The tape used to hold the packages does not lose its adhesiveness over this time.Storage of die on Surftape for a period longer than 2 years is not recommended due toincreased adhesion. The increased adhesion can lead to pick-and-place issues and,possibly, die damage.
8. Ionics and outgassing: The plastic used for this carrier tape meets TI ionics andoutgassing requirements (see Table 1). One concern customers have is the outgassing ofthe adhesive tape, leading to contaminated bond pads on the die surface. The adhesivetape has been used in expanded-wafer sales and has not caused any contaminationissues. Die stored in Surftape have been analyzed, and contamination has not beenobserved. Another concern customers have with Surftape is the possibility ofcontamination. The absence of a cover tape leaves the die open to environmentalcontamination if not handled correctly. At TI, the die is placed on the Surftape in acontrolled environment and shipped in a moisture-barrier bag with desiccant to preventany contamination during shipment or while sitting on the customer’s shelf. Customerhandling of the die must prevent contact with a hazardous environment. It isrecommended that the customer store excess die for future production in amoisture-barrier bag for protection. http://www.conplastech.com/en/index.asp?id=77
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